Thin Wall Molding
Cannot Use Mold Release Agents
Plastic thin wall molds can't use mold release lubricants, wash, wax, spray and other parting agents. It is an intricate process that few can master. Only the highly skilled and experienced fabricators can produce such tiny, delicate parts because of the high occurrance of rejected parts.Wrong-angled and elongated profiles are caused by sticking and stretching of resin during mold release. These types of rejects form the majority of failure rates. The problem becomes unmanageable with sticky resins.
Modified Substances Cause More Problems
Today, many plastic fabricators have resorted to using low-viscosity fluids to aid mold release in plastic thin wall molds. Extremely thin applications of these fluids are repeatedly administered for every single production cycle.This gives rise to problems in short molding, fish-eyes and transmigration of the fluids onto finished plastic products. Fragility and complex profiles of the finished parts make cleaning a difficult, time-consuming task.
Highly Polished Surfaces
Other plastic fabricators use diamond
lapping to improve mold release. But polishing does not removes pores
and creavices; it reduces their size. These tiny pores and creavices
becomes bigger and deeper with repeated exposure to molten resinoid
compounds.
These polished molds are subject to wear and tear.
After a certain number of production cycles, they have to be taken down
and sent for re-polishing. Much time, effort and money is spent doing
this.
Modifications are the Last Resort
If all these techniques fail, the mold is sent for
repeated modifications untill a solution can be found. But if these
modifications still cannot solve the problem, new mold designs must be
made from scratch.As can be seen, this type of molding is indeed difficult and time-consuming. But these problems can be avoided by keeping up with technology.
Mold release lubricants, wash, wax, spray and parting agents cannot be used to solve plastic thin wall mold problems. Nanomouldrelease can.
