Mold Release Problems
Mold
release problems: demands in mold design,
cosmetic value requirements and the type of material used in
fabrication. Strangely, other types of mold release problems are
usually caused substances and techniques that are supposed to solve
such problems.
With The Aid Of Nanotechnology
The modern day
approach in solving mold release problems is with the incorporation of
nanotechnology. With such advancements, it is now
possible to scrutinize matter and processes in greater detail. This
makes it easier to accurately investigate and identify the root causes
of mold release problems.
Surface Topography
Surface topography and surface chemistry are the main root causes of mold release problems. The physical roughness of mold cavities promote friction as well as provide ideal areas where resin can attach itself to.
Chemical Reactivity
Chemical
reactivity of mold cavity surfaces invite the onset of corrosion and
abrasion. As long as mold cavity surfaces come into contact
with
other chemically reactive substances, corrosion will set it.
And
as the process of corrosion accelerates, pitting and crevices on the
mold cavity surfaces will get larger and larger untill the mold cavity
surface is rough enough to participate in another process: friction.
Friction
and abrasion accelerate each other. Abrasion makes the surface even
rougher and this produces a higher coefficient of friction.
Root Causes Of Mold Release Problems Are Identified
Mold release problems: as can be seen, physical roughness and chemical reactivity of mold cavity surfaces are inter-related. They are the root causes of mold release sticking, resin build ups that cause parts to get stuck in the mold and poor cosmetic finishings of fabricated parts.
Other Causes of Mold Release Problems
When mold
release agents are applied onto mold cavity surfaces, short molding can
occur. This type of problems is where parts with missing profiles and
fish-eye irregularities become visible on fabricated parts.
Mold
release agents can also create a luting effect that causes parts to get
stuck in the mold. This form of vacuum bonding occurs when air cannot
flow onto vital areas of the mold cavity surface, making mold release
impossible.
Cross-contamination and transmigration of
contaminants also result from the use of mold release agents such as
mold wash, mold wax, mold sprays and other such parting agents.
Nanotechnological Solution
Nanomouldrelease is the product of advancements in nanotechnology. It gets to the root
of the problem and fixes it.
Unlike mold release agents that must be applied over and over again, an application of Nanomouldrelease has been known to last for more 100,000 cycles and does not
transmigrate to fabricated parts.
Find out about how Nanomouldrelease can solve your mold release problems today.
