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Mold Release Nanotechnology

Mold Release Nanotechnology is the microscopic investigation, identification and rectification of mold release problems. It addresses the real underlying problems in mold release.

Drag, lag and stretch marks are not problems. Neither are sticky plastic resins or the buildup of such resins on mold surfaces. These are only the symptoms of mold cavity surfaces that are prone to friction, abrasion and adhesion.

Surfaces prone to friction, abrasion and adhesion, are surfaces that things can rub against or get stuck to. In the case of plastic molding, kinetic and chemical forces in mold cavity surfaces attract resin to stick to it.

But these forces are not the problem either. The real problem lies in the surface topography and chemical properties of the mold cavity surface that produce such forces.

 
Kinetic (physical) forces, in this case, refer to friction and atmospheric pressure while chemical (electrical) forces refer to attraction. Solving mold release problems requires the lowering of friction and reversal of chemical forces inherent in mold cavity surfaces.
 
By using Scanning Electron Microscopy, the surface of a smooth substrate resembles a landscape riddled with mountains, canyons, hills, valleys and fault lines. It is on these microscopic features that resin secures a foothold on which to attach itself to.
 
Microscopic roughness provides the kinetic resistance which enables the principles of friction and abrasion to take effect. The rougher the surface, the more friction is produced and rate of abrasion is increased.
 
Microscopic roughness also impedes the flow of air, vital to maintaining equilibrium in atmospheric pressure for all areas of the mold cavity. This equilibrium  facilitates good mold release. Sudden or delayed changes in air pressure due to obstructed or impeded air flow result in deformities and stretch marks.

The inherent molecular alkene properties of metals that molds are fabricated from allow interaction between mold and resin. Though these chemical interactions begin as microscopic resinous buildups on mold surfaces, the buildups progressively increase in size with every production cycle.

Another consequence of chemical interaction is corrosion. Electron loss and oxidization are root causes of pitting (formation of cracks). Whether the cause of corrosion is due to contact  with air, mold release agents, resinous compounds or cleaning sustances, continual exposure to any environment or substance that removes electrons or causes oxidization will increase the size of these pits.

When the dimensions of these pits reach a critical level, corrosion accelerates and the kinetic forces of friction and abrasion factor in.

From what has been discussed so far, it is clear that mold release problems can be solved by smoothening mold cavity surfaces and alterring the chemical properties of such surfaces.

Today, there is a product that can do this. This product is called Nanomouldrelease.

Nanomouldrelease is a nano-scale surface coating that completely seals up substrate surfaces. It also flatens microscopic landscapes by filling up all the canyons, valleys and fault lines and thus, producing true smoothness. Resin can no longer attach itself to coated surfaces and air flow becomes smooth and quick.
 
Nanomouldrelease is a colorless, chemically non-reactive (inert) coating that exudes a chemically repulsive force. This chemically stable coating possesses both lipophobic (oil repelling) and hydrophobic (water repelling) properties but, at the same time, allows gases to pass through it.

Nanomouldrelease is the new horizon to the Plastic Fabrication Industry.

 
 
 
*A nanometer is a thousand times smaller than a micron and a million times smaller than a millimeter.